Submission Deadline – 5:00 p.m., 10th March, 2017 (Japan Time)
PRESENTATION & MANUSCRIPT PREPARATION
ISHPC2017 will hold 100-150 oral presentations. No poster presentation is scheduled. Each oral presenter is requested to submit an extended abstract with 2 pages in A4 paper. It may include figures and tables. The format and template of extended abstract will appear on the ISHPC2017 web site (http://biz.knt.co.jp/tour/2017/ISHPC2017/). The submitted extended abstracts will be peer-reviewed, and the program committee may request revisions of the extended abstract to the author.
IJR SPECIAL ISSUE
About 20 high-class papers selected from the extended abstracts of the ISHPC2017 will be recommended to a special issue of the International Journal of Refrigeration (IJR). The authors of the selected abstracts will be requested to submit full papers to the ISHPC2017 Special issue of IJR after the conference.
Impact Factor of IJR: 2.291
Guest editors for the special issue: Prof. Bidyut Baran SAHA
Prof. Kiyoshi SAITO
Prof. Keumnam CHO
APPLIED SCIENCES AWARD
One of the best papers selected from the extended abstracts of the ISHPC2017 will be awarded by Applied Sciences. The awarded paper is recommended to submit a full paper to the special issue “Sciences in Heat Pump and Refrigeration” in Applied Sciences. Article Processing Charge (1200 CHF) will be waived for the awarded paper.
Impact Factor of Applied Sciences: 1.726
Special issue editor of “Sciences in Heat Pump and Refrigeration”
THE ALEFELD AWARD
The Alefeld award is granted for outstanding scientific or engineering contributions and eminent achievements in the field of sorption heat pump/refrigeration technology. These contributions should yield a deeper insight into physical phenomena involved or should yield significant technological advances. In addition to research, the Award Recipient should have made outstanding contributions to the field through teaching, or design, or a combination of such activities.
Please submit nominations to:
Prof. Kiyoshi Saito at firstname.lastname@example.org