Venue

 

Technology and Innovation Center (TIC)

1-1, Nishi-Hitotsuya, Settsu, Osaka 566-8585 Japan

(https://www.daikin.com/index.html)

 

 

 

 

Transportation

Getting to Technology and Innovation Center

Travel from Kansai International Airport (KIX) to Shin-Osaka Station on the Express Haruka train in 50 minutes, or from Osaka International Airport (Itami) to Shin-Osaka through Senri Chuo in about 25 minutes.

 

 

 

 

 

 

Important Dates

Paper Submission

・Abstract Submission
 Autumn 2020

Registration

 Coming soon

Supporters